Schematics claiming to be of Apple’s upcoming iPhone 7 “Pro” have appeared in Japanese magazine Mac Fan, according to a new report by Mac Otakara.
The leaked specs support many of rumoured details about the upcoming device, including the reports of a dual-camera system, body design similar to the iPhone 6s Plus, and elimination of the headphone jack.
The MacFan report claims the new iPhone will actually measure in at 158.22mm tall by 77.94mm wide by 7.3mm thick — identical to the dimensions of the current iPhone 6s Plus.
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