Apple’s next-generation iPhone will feature a thinner screen and use new nano SIM technology, according to a pair of new reports. Citing people familiar with the matter, the Wall Street Journal reports that the next-generation iPhone will sport panels using in-cell technology. In-cell integrates touch sensors into the LCD, reducing the panel’s overall thickness, and improving the quality of displayed images.
The report claims that Sharp, Japan Display, and LG Display are all currently mass producing panels for the device.
In a separate report, the Financial Times reports that European mobile operators are currently stockpiling a new, miniature SIM card—referred to as a nano-SIM—in anticipation of the technology being used in Apple’s next-generation iPhone. Citing two sources with knowledge of the situation, the report claims that operators expect the next-gen iPhone to take advantage of the standard, which Apple helped shape.
The report notes that Apple caught some operators by surprise by adopting the micro SIM standard in the iPhone 4 and original iPad in 2010, leading to supply shortages in the early weeks of those devices going on sale. Apple is expected to announce its next-generation iPhone sometime this fall.
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