Taiwan Semiconductor Manufacturing has started production of the A13 chipset that will power the new 2019 iPhones. Fabrication for the next-gen chip will be via 7nm process. The power-efficient component is expected to improve both performance and battery life as well as advanced features such as AI, and more.
Its previous predecessor, the A12 also uses the 7nm procedure, but TSMC states that the A13 will be different as it will make use of a newer technology called extreme ultraviolet lithography.
The upcoming iPhone models are expected to be released with the name “iPhone 11” and “11 Max”, with more affordable options similar to the XR models as well. Slashleaks reveal possible iPhone designs such as the triple-lens rear camera ensconced within a square module, the same notch design as with its predecessors and 2 sensors near the speaker holes.
Speculation states that a 3D camera may be added for improved Face ID and applicable iPhone features.